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MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts
4.8 (127 items)
Limited Time SaleUntil the end
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US$38.41 cheaper than the new price!!
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Used US$25.60
Product details
| Management number | 221086204 | Release Date | 2026/05/03 | List Price | US$25.60 | Model Number | 221086204 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage
- Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates
- None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components
- Opaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium Setting
- Low Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature
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